Quality Control & Development
ISO 9001:2000 The Highest Quality Standard


The Electrolizing Corporation of Ohio utilizes a variety of highly sophisticated equipment to assure the precision of our micro-plating and coating. Metal finishing for micromachined parts depends on the ability to analyze and inspect finish quality on subminiature levels. The same technology that allows this advanced capability also supports the development of new and better finishes and process techniques.

A combination of microscopic, X-ray, atomic analysis and optical inspection equipment enables the highest quality finishing of exceptionally small parts. The Electrolizing Corporation of Ohio is fully equipped to provide superior quality control of all finishing procedures.

NIKON MICROSCOPE
With a magnification of up to 260X, this powerful microscope gives Electrolizing the capability of visually analyzing the precision of plating and coating on even the smallest parts. In many cases, these are so small that unassisted visual inspection of the part itself is difficult, if not impossible. Plating thicknesses on surfaces measured in ten-thousandths of an inch must be precise and even. This Nikon microscope brings these micro-miniature elements into view with exceptional clarity. Inspection on a microscopic level also exposes imperfections or process faults that can then be adjusted to insure the optimum quality of the plating.

Equipment includes on-line digital camera

Specifications
• Nikon Microscope
• Magnification: up to 260X
• Fully on-line integrated with real-time send capabilities
• Optical and digital images
• Computer controlled camera
• Download to e-mail or disk

X-RAY EQUIPMENT
CMI-950 Fluorescence Measurement System

Providing both optical and digital analysis with X-Ray Radio Frequency, this device offers the most accurate method of determining plating thickness other than destructive testing. The spectrographic capabilities of the X-Ray Fluorescence Measurement System also allow the composition analysis of the part and its plating. This equipment is used extensively in the plating of micromachined medical, nuclear, telecommunications, data communications and fiber optic components. And job costs impacted by precious metal plating especially benefit from the ability to determine precise plating dimensions. The accuracy of this technology allows exceptional process control and inspection capabilities on all plating methods with the exception of anodizing.

X-Ray Florescence Units - measurers plating thickness

 

Specifications

  • CMI-950 X-Ray Fluorescence Measurement System
  • X-Ray Radio Frequency provides optical and digital images
  • Color camera – up to 30X magnification
  • CMI’s SmartLink™, FP Windows™ - based operating system
  • Programmable Tri-Axis control package
  • Maximum part height: 5.90”
  • Accuracy: ± .000005”
  • Thickness measurement range:  .000005 - .001”
  • Range: .0002 - .0005”

ATOMIC ABSORPTION UNIT
Perkin Elmer Analyst 300 Unit

Our Atomic Absorption Unit (AAU) is a superior analytical tool that provides a number of capabilities for process development, regulatory compliance and plating quality. This complex equipment provides a finite solution analysis of precipitated metals. By detecting metals in a solution, a chemical or metallurgical engineer can analyze and adjust plating constituents. Immediate modifications can be made, reducing response time and increasing project efficiency. In addition, the AAU is invaluable in the preventive maintenance of solutions, an important consideration in the management of time, cost and quality. The AAU allows significant opportunities for developing proprietary solutions in direct response to customer needs. In addition, the AAU puts Electrolizing on the cutting edge of regulatory compliance by providing unsurpassed solution analysis and correction capabilities.

Specifications
• Perkin Elmer Analyst 300 Unit
• WinLab Controller Program with Windows™ operating   system
• Automatic 6-lamp turret
• Analyze the following elements in solution to .5 ppm:
          • Pb (Lead) • Cr (Chrome • Fe (Iron)
          • Cd (Cadmium) • P (Phosphorus)
          • Ag (Silver) • Cu (Copper)
          • Ni (Nickel) • Zn (Zinc)
          • Ba (Barium) • Trivalent Chrome
          • Sulfates and Chlorides in aqueous solutions

ADDITIONAL QUALITY CONTROL/ANALYSIS EQUIPMENT
The Electrolizing Corporation of Ohio employs a high number of inspection-to-production personnel to insure the quality of our finishing. Our technicians and engineers have the expertise to maximize the capabilities of our inspection equipment. The technology provided by microscopic, X-Ray and molecular analysis is complemented by a variety of modern, conventional inspection options.

Additional Equipment/Capabilities
• CMI XRX X-Ray System for Nuclear Applications
• Fischer Eddy current thickness gages
• Nikon V-12-B optical comparator
• Mitutoyu 0-1 digital micrometers
• Full complement of micrometers/bore gages to 16”   diameter, ID and OD

Registered to ISO 9001:2000

 
E-mail The Electrolizing Corporation of OHIO Copyright © 2008 The Electrolizing Corporation of Ohio